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PRELIMINARY
V*I Chip Voltage Transformation Module
BCM V*I Chip - BCM Bus Converter Module
TM
B048K120T30
K indicates BGA configuration. For other mounting options see Part Numbering below.
* 48 V to 12 V V*I Chip Converter * 300 Watt (450 Watt for 1 ms) * High density - 1200 W/in3 * Small footprint - 280 W/in2 * Low weight - 0.5 oz (14 g) * ZVS/ZCS isolated sine amplitude converter
* 96% efficiency * 125C operation * <1 s transient response * 3.5 million hours MTBF * No output filtering required * Surface mount BGA or J-Lead packages
(c)
Vin = 38 - 55 V Vout = 9.5 - 13.7 V Iout = 25 A K = 1/4 Rout = 13.9 m max
Actual size
Product Description
The V*I Chip Bus Converter Module (BCM) is a high efficiency (>96%), narrow input range Sine Amplitude Converter (SAC) operating from a 38 to 55 Vdc primary bus to deliver an isolated 9.5 V to 13.7 V secondary. The BCM may be used to power non-isolated POL converters or as an independent 9.5 - 13.7 V source. Due to the fast response time and low noise of the BCM, the need for limited life aluminum electrolytic or tantalum capacitors at the input of POL converters is reduced--or eliminated--resulting in savings of board area, materials and total system cost. The BCM achieves a power density of 1200 W/in3 and may be surface mounted with a profile as low as 0.16" (4 mm) over the PCB. Its V*I Chip power package is compatible with onboard or inboard surface mounting. The V*I Chip package provides flexible thermal management through its low Junction-to-Case and Junction-to-BGA thermal resistance. Owing to its high conversion efficiency and safe operating temperature range, the BCM does not require a discrete heat sink in typical applications. It is also available with heat sink options, assuring low junction temperatures and long life in the harshest environments.
Absolute Maximum Ratings
Parameter
+In to -In +In to -In PC to -In +Out to -Out Isolation voltage Output current Peak output current Output power Peak output power Case temperature Operating junction temperature (1) Storage temperature Note:
(1) The referenced junction is defined as the semiconductor having the highest temperature. This temperature is monitored by a shutdown comparator.
Values
-1.0 to 60 100 -0.3 to 7.0 -0.5 to 30.0 2,250 25 37.5 300 450 208 -40 to 125 -55 to 125 -40 to 150 -65 to 150
Unit
Vdc Vdc Vdc Vdc Vdc A A W W C C C C C
Notes
For 100 ms
Input to Output Continuous For 1 ms Continuous For 1 ms During reflow T - Grade M - Grade T - Grade M - Grade
Part Numbering
B
Bus Converter Module
048
Input Voltage Designator
K
120
Output Voltage Designator (=VOUT x10)
T
30
Output Power Designator (=POUT/10)
Configuration Options F = Onboard (Figure 20) K = Inboard (Figure 19)
Product Grade Temperatures (C) Grade Storage Operating T -40 to150 -40 to125 M -65 to150 -55 to125
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V*I Chip Bus Converter Module
B048K120T30
Rev. 1.0
Page 1 of 16
PRELIMINARY
Specifications
Input (Conditions are at 48 Vin, full load, and 25C ambient unless otherwise specified)
Parameter
Input voltage range Input dV/dt Input undervoltage turn-on Input undervoltage turn-off Input overvoltage turn-on Input overvoltage turn-off Input quiescent current Inrush current overshoot Input current Input reflected ripple current No load power dissipation Internal input capacitance Internal input inductance Recommended external input capacitance
V*I Chip Voltage Transformation Module
Min
38
Typ
48
Max
55 1 37.4
Unit
Vdc V/s Vdc Vdc Vdc Vdc mA A Adc mA p-p W F nH F
Note
32.6 55 59 2.5 2.0 6.8 170 4.7 4 20 47 5.7
PC low Using test circuit in Figure 21; See Figure 1 Using test circuit in Figure 21; See Figure 4
200 nH maximum source inductance; See Figure 21
Input Waveforms
Figure 1-- Inrush transient current at full load and 48 Vin with PC enabled
Figure 2-- Output voltage turn-on waveform with PC enabled at full load and 48 Vin
Figure 3--Output voltage turn-on waveform with input turn-on at full load and 48 Vin
Figure 4-- Input reflected ripple current at full load and 48 Vin
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V*I Chip Bus Converter Module
B048K120T30
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Page 2 of 16
PRELIMINARY
Specifications
(continued)
V*I Chip Voltage Transformation Module
Output (Conditions are at 48 Vin, full load, and 25C ambient unless otherwise specified)
Parameter
Output voltage Rated DC current Peak repetitive current DC current limit Current share accuracy Efficiency Half load Full load Internal output inductance Internal output capacitance Load capacitance Output overvoltage setpoint Output ripple voltage No external bypass 10 F bypass capacitor Average short circuit current Effective switching frequency Line regulation K Load regulation ROUT Transient response Voltage overshoot Response time Recovery time Output overshoot Input turn-on PC enable Output turn-on delay From application of power From release of PC pin 25.5 30.0 5 95.5 96.0 1.1 55 1,000 13.8 144 12.8 0.16 2.8 1/4 11.7 355 200 1 0 0 308 80 214
Min
9.5 9.2 0
Typ
Max
13.7 13.4 25 37.5 36.3 10
Unit
Vdc Vdc Adc A Adc % % % nH F F Vdc mV mV A MHz
Note
No load Full load Module will shut down when current limit is reached or exceeded Max pulse width 1ms, max duty cycle 10%, baseline power 50% See Parallel Operation on Page 12 See Figure 5 See Figure 5 Effective value
95.0 95.0
See Figures 7 and 9 See Figure 8 Fixed, 1.4 MHz per phase VOUT = K*VIN at no load
2.5 0.2475
3.2 0.2525 13.9
m mV ns s mV mV ms ms 100% load step; See Figures 10 and 11 See Figures 10 and 11 See Figures 10 and 11 No output filter; See Fig.3 No output filter; See Fig.2 No output filter; See Fig.3 No output filter
Output Waveforms
Efficiency vs. Output Power
98 96 14
Power Dissipation vs. Output Power
12 10 8 6 4 2 0
Efficiency (%)
94 92 90 88 86 84 0 30 60 90 120 150 180 210 240 270 300
Power Dissipation (W)
0
30
60
90
120
150
180
210
240
270
300
Output Power (W)
Output Power (W)
Figure 5-- Efficiency vs. output power at 48 Vin
Figure 6--Power dissipation as a function of output power
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V*I Chip Bus Converter Module
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Page 3 of 16
PRELIMINARY
Specifications
(continued)
V*I Chip Voltage Transformation Module
Figure 7-- Output voltage ripple at full load and 48 Vin; without any external bypass capacitor.
Figure 8--Output voltage ripple at full load and 48 Vin with 10 F ceramic external bypass capacitor and 20 nH of distribution inductance.
Ripple Voltage vs. Output Power
160 140
Output Ripple (mVpk-pk)
120 100 80 60 40 20 0 0 30 60 90 120 150 180 210 240 270 300
Output Power (W)
Figure 9-- Output voltage ripple vs. output power at 48 Vin line without any external bypass capacitor.
Figure 10-- 0 -25 A load step with 47 F input capacitor and no output capacitor.
Figure 11-- 25- 0 A load step with 47 F input capacitance.
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Page 4 of 16
PRELIMINARY
Specifications
General
Parameter
MTBF MIL-HDBK-217F Telcordia TR-NT-000332 Isolation specifications Voltage Capacitance Resistance Agency approvals (pending) Mechanical parameters Weight Dimensions Length Width Height 1.26 / 32 0.85 / 21.5 0.23 / 6 in / mm in / mm in / mm 0.50 / 14 oz / g 10 cTUVus CE Mark 2,250 3,000 Vdc pF M Input to Output Input to Output Input to Output UL/CSA 60950, EN 60950 Low voltage directive See Mechanical Drawing, Figures 15 and 17 3.5 4.2 Mhrs Mhrs 25C, GB
(continued)
V*I Chip Voltage Transformation Module
Min
Typ
Max
Unit
Note
Auxiliary Pins (Conditions are at 48 Vin, full load, and 25C ambient unless otherwise specified)
Parameter
Primary control (PC) DC voltage Module disable voltage Module enable voltage Current limit Enable delay time Disable delay time 2.4 4.8 2.4 5.0 2.5 2.5 2.5 80 10 2.6 2.9 5.2 Vdc Vdc Vdc mA ms s See Fig.12 time from PC low to output low Source only
Min
Typ
Max
Unit
Note
Figure 12-- VOUT at full load vs. PC disable
Figure 13-- PC signal during fault
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Page 5 of 16
PRELIMINARY
Specifications
Thermal
Symbol Parameter
Over temperature shutdown Thermal capacity RJC RJB RJA RJA Junction-to-case thermal impedance Junction-to-BGA thermal impedance Junction-to-ambient (1) Junction-to-ambient (2)
(continued)
V*I Chip Voltage Transformation Module
Min
125
Typ
130 0.61 1.1 2.1 6.5 5.0
Max
135 1.5 2.5 7.2 5.5
Unit
C Ws/C C/W C/W C/W C/W
Note
Junction temperature BGA package
Notes: (1 B048K120T30 surface mounted in-board to a 2" x 2" FR4 board, 4 layers 2 oz Cu, 300 LFM. (2) B048K120T30 with optional 0.25"H Pin Fins surface mounted on FR4 board, 300 LFM.
V*I Chip Stress Driven Product Qualification Process
Test
High Temperature Operational Life (HTOL) Temperature cycling High temperature storage Moisture resistance Temperature Humidity Bias Testing (THB) Pressure cooker testing (Autoclave) Highly Accelerated Stress Testing (HAST) Solvent resistance/marking permanency Mechanical vibration Mechanical shock Electro static discharge testing - human body model Electro static discharge testing - machine model Highly Accelerated Life Testing (HALT) Dynamic cycling
Standard
JESD22-A-108-B JESD22-A-104B JESD22-A-103A JESD22-A113-B EIA/JESD22-A-101-B JESD22-A-102-C JESD22-A-110B JESD22-B-107-A JESD22-B-103-A JESD22-B-104-A EIA/JESD22-A114-A EIA/JESD22-A115-A Per Vicor Internal Test Specification(1) Per Vicor internal test specification(1)
Environment
125C, Vmax, 1,008 hrs -55C to 125C, 1,000 cycles 150C, 1,000 hrs Moisture sensitivity Level 5 85C, 85% RH, Vmax, 1,008 hrs 121C, 100% RH, 15 PSIG, 96 hrs 130C, 85% RH, Vmax, 96 hrs Solvents A, B & C as defined 20g peak, 20-2,000 Hz, test in X, Y & Z directions 1,500g peak 0.5 ms pulse duration, 5 pulses in 6 directions Meets or exceeds 2,000 Volts Meets or exceeds 200 Volts Operation limits verified, destruct margin determined Constant line, 0-100% load, -20C to 125C
Note: (1) For details of the test protocols see Vicor's website.
V*I Chip Ball Grid Array Interconnect Qualification
Test
BGA solder fatigue evaluation Solder ball shear test Standard IPC-9701 IPC-SM-785 IPC-9701 Environment Cycle condition: TC3 (-40 to +125C) Test duration: NTC-B (500 failure free cycles) Failure through bulk solder or copper pad lift-off
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V*I Chip Bus Converter Module
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Rev. 1.0
Page 6 of 16
PRELIMINARY
Pin/Control Functions
+IN/-IN - DC Voltage Input Ports The V*I Chip input voltage range should not be exceeded. An internal under/over voltage lockout-function prevents operation outside of the normal operating input range. The BCM turns ON within an input voltage window bounded by the "Input under-voltage turn-on" and "Input over-voltage turn-off" levels, as specified. The V*I Chip may be protected against accidental application of a reverse input voltage by the addition of a rectifier in series with the positive input, or a reverse rectifier in shunt with the positive input located on the load side of the input fuse. The connection of the V*I Chip to its power source should be implemented with minimal distribution inductance. If the interconnect inductance exceeds 100 nH, the input should be bypassed with a RC damper to retain low source impedance and stable operation. With an interconnect inductance of 200 nH, the RC damper may be a 47 F in series with 0.3. A single electrolytic or equivalent low-Q capacitor may be used in place of the series RC bypass. PC - Primary Control The Primary Control port is a multifunction node that provides the following functions: Enable/Disable - If the PC port is left floating, the BCM output is enabled. Once this port is pulled lower than 2.4 Vdc with respect to -In, the output is disabled. This action can be realized by employing a relay, opto-coupler, or open collector transistor. Refer to Figures 1-3, 12 and 13 for the typical Enable/Disable characteristics. This port should not be toggled at a rate higher than 1 Hz. The PC port should also not be driven by or pulled up to an external voltage source. Primary Auxiliary Supply - The PC port can source up to 2.4 mA at 5.0 Vdc. The PC port should never be used to sink current. Alarm - The BCM contains circuitry that monitors output overload, input over voltage or under voltage, and internal junction temperatures. In response to an abnormal condition in any of the monitored parameters, the PC port will toggle. Refer to Figure 13 for PC alarm characteristics. TM and RSV - Reserved for factory use. +OUT/-OUT - DC Voltage Output Ports Two sets of contacts are provided for the +Out port. They must be connected in parallel with low interconnect resistance. Similarly, two sets of contacts are provided for the -Out port. They must be connected in parallel with low interconnect resistance. Within the specified operating range, the average output voltage is defined by the Level 1 DC behavioral model of Figure 25. The current source capability of the BCM is rated in the specifications section of this document. The low output impedance of the BCM, reduces or eliminates the need for limited life aluminum electrolytic or tantalum capacitors at the input of POL converters. Total load capacitance at the output of the BCM should not exceed the specified maximum. Owing to the wide bandwidth and low output impedance of the BCM, low frequency bypass capacitance and significant energy storage may be more densely and efficiently provided by adding capacitance at the input of the BCM. V*I Chip Voltage Transformation Module
43 A B C D E F G H J K L M N P R T U V W Y AA AB AC AD AE AF AG AH AJ AK AL
21 A B C D E F G H J K L M N P R T U V W Y AA AB AC AD AE AF AG AH AJ AK AL
+Out
+In
-Out
TM RSV PC
+Out
-In
-Out
Bottom View
Signal NameDesignation +In -In TM RSV PC +Out -Out
BGA A1-L1, A2-L2 AA1-AL1, AA2-AL2 P1, P2 T1, T2 V1, V2 A3-G3, A4-G4, U3-AC3, U4-AC4 J3-R3, J4-R4, AE3-AL3, AE4-AL4
Figure 14--BCM BGA configuration
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V*I Chip Bus Converter Module
B048K120T30
Rev. 1.0
Page 7 of 16
PRELIMINARY
Mechanical Drawings
V*I Chip Voltage Transformation Module
1,00 0.039
SOLDER BALL #A1 INDICATOR
18,00 0.709 9,00 0.354
1,00 0.039
SOLDER BALL #A1
21,5 0.85
5,9 0.23
0.020 (106) X O 0.51
SOLDER BALL
1,00 TYP 0.039
OUTPUT
30,00 1.181
INPUT
INPUT
OUTPUT
32,0 1.26
28,8 1.13 16,0 0.63
C L
15,00 0.591
TOP VIEW (COMPONENT SIDE)
1,6 0.06
C L
BOTTOM VIEW
1,00 0.039
3,9 0.15 NOTES: mm 1- DIMENSIONS ARE inch . 2- UNLESS OTHERWISE SPECIFIED, TOLERANCES ARE: .X/[.XX] = +/-0.25/[.01]; .XX/[.XXX] = +/-0.13/[.005] 3- PRODUCT MARKING ON TOP SURFACE
15,6 0.62
SEATING PLANE
Figure 15-- BCM BGA mechanical outline; Inboard mounting
IN-BOARD MOUNTING BGA surface mounting requires a cutout in the PCB in which to recess the V*I Chip
(o 0,51 ) 0.020 0,50 0.020
1,50 0.059 ( 1,00 ) 0.039 o 0,53 PLATED VIA 0.021
CONNECT TO INNER LAYERS
SOLDER MASK DEFINED PADS
0,50 0.020
( 1,00 ) 0.039 1,00 0.039 9,00 0.354
1
18,00 0.709
1,00 0.039
1,00 0.039
SOLDER PAD #A1
(2) X 10,00 0.394
+IN
(4) X 6,00 0.236
+OUT1 -OUT1
RECOMMENDED LAND AND VIA PATTERN
TM
(COMPONENT SIDE SHOWN)
PCB CUTOUT
RSV
29,26 1.152 24,00 0.945 16,00 0.630 8,00 0.315 0,37 0.015 1,6 (4) X R 0.06 NOTES: mm 1- DIMENSIONS ARE inch . 2- UNLESS OTHERWISE SPECIFIED, TOLERANCES ARE: .X/[.XX] = +/-0.25/[.01]; .XX/[.XXX] = +/-0.13/[.005]
20,00 0.787 17,00 0.669 15,00 13,00 0.591 0.512
+OUT2
-IN
PC
31
-OUT2
0,51 (106) X o 0.020
SOLDER MASK DEFINED PAD
8,08 0.318 16,16 0.636
Figure 16--BCM BGA PCB land/VIA layout information; Inboard mounting
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V*I Chip Bus Converter Module
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Rev. 1.0
Page 8 of 16
PRELIMINARY
Mechanical Drawings (continued)
V*I Chip Voltage Transformation Module
22,0 0.87
6,1 0.24
3,01 0.118
15,99 0.630
3,01 0.118
(4) PL. 7,10 0.280 OUTPUT INPUT
11,10 (2) PL. 0.437
32,0 1.26
INPUT
24,00 0.945 16,00 0.630
TOP VIEW (COMPONENT SIDE)
Figure 17-- BCM J-Lead mechanical outline; Onboard mounting
(4) X 11,48 0.452
(6) X
1,60 0.063
+IN
20,00 (2) X 0.787 (2) X16,94 0.667 (2) X14,94 0.588 12,94 (2) X 0.509
PC RSV TM
-IN
Figure 18-- BCM J-Lead PCB land layout information; Onboard mounting
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OUTPUT 3,26 0.128 1,38 0.054 TYP 15,74 0.620
C L
15,55 0.612 8,00 0.315
C L
12,94 0.509
14,94 0.588
16,94 0.667
20,00 0.787
0,45 0.018
BOTTOM VIEW
NOTES: 1- DIMENSIONS ARE mm/[INCH]. 2- UNLESS OTHERWISE SPECIFIED, TOLERANCES ARE: .X/[.XX] = +/-0.25/[.01]; .XX/[.XXX] = +/-0.13/[.005] 3- PRODUCT MARKING ON TOP SURFACE.
3,26 0.128 0,51 TYP 0.020
RECOMMENDED LAND PATTERN
(COMPONENT SIDE SHOWN)
+OUT1 -OUT1 +OUT2 -OUT2
7,48 (8) X 0.295
(2) X 24,00 0.945 (2) X 16,00 0.630 8,00 (2) X 0.315
NOTES: 1- DIMENSIONS ARE mm/[INCH]. 2- UNLESS OTHERWISE SPECIFIED, TOLERANCES ARE: .X/[.XX] = +/-0.25/[.01]; .XX/[.XXX] = +/-0.13/[.005]
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V*I Chip Bus Converter Module
B048K120T30
Rev. 1.0
Page 9 of 16
PRELIMINARY
Configuration Options
V*I Chip Voltage Transformation Module
Configuration Effective power density Junction-Board thermal resistance Junction-Case thermal resistance Junction-Ambient thermal resistance 300LFM
Inboard (1) (Package K) 1750 W/in3 2.1 C/W 1.1 C/W
Onboard (1) (Package F) 1090 W/in3 2.4 C/W 1.1 C/W
Inboard with 0.25" Pin Fins (2) 680 W/in3 2.1 C/W N/A
Onboard with 0.25" Pin Fins (2) 550 W/in3 2.4 C/W N/A
6.5 C/W
6.8 C/W
5.0 C/W
5.0 C/W
Notes: (1) Surface mounted to a 2" x 2" FR4 board, 4 layers 2 oz Cu (2) Pin Fin heat sink available as a separate item
21.5 0.85
22.0 0.87
32.0 1.26
32.0 1.26
4.0 0.16
6.3 0.25
INBOARD MOUNT (V*I Chip recessed into PCB)
mm in
ONBOARD MOUNT
mm in
Figure 19--Inboard mounting - package K
Figure 20-- Onboard mounting - package F
Input reflected ripple measurement point
F1 15 A Fuse
+In Enable/Disable Switch +Out
+
R3 10 m typ. C3 10 F
C1 47 F
electrolytic SW1
2K
R2
TM RSV PC
BCM K Ro
-Out
Load
D1
-In
+Out
-Out
-
Notes: Source inductance should be no more than 200 nH. If source inductance is greater than 200 nH, additional bypass capacitance may be required. C3 should be placed close to the load. R3 may be ESR of C3 or a seperate damping resistor. D1 power good indicator will dim when a module fault is detected.
Figure 21--BCM test circuit
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Page 10 of 16
PRELIMINARY
Application Note
Parallel Operation The BCM will inherently current share when properly configured in an array of BCMs. Arrays may be used for higher power or redundancy in an application. Current sharing accuracy is maximized when the source and load impedance presented to each BCM within an array are equal. The recommended method to achieve matched impedances is to dedicate common copper planes within the PCB to deliver and return the current to the array, rather than rely upon traces of varying lengths. In typical applications the current being delivered to the load is larger than that sourced from the input, allowing traces to be utilized on the input side if necessary. The use of dedicated power planes is, however, preferable. The BCM power train and control architecture allow bi-directional power transfer, including reverse power processing from the BCM output to its input. Reverse power transfer is enabled if the BCM input is within its operating range and the BCM is otherwise enabled. The BCM's ability to process power in reverse improves the BCM transient response to an output load dump. Thermal Management The high efficiency of the V*I Chip results in relatively low power dissipation and correspondingly low generation of heat. The heat generated within internal semiconductor junctions is coupled with low effective thermal resistances, RJC and RJB, to the V*I Chip case and its Ball Grid Array allowing thermal management flexibility to adapt to specific application requirements (Figure 22). CASE 1 Convection via optional Pin Fins to air. If the application is in a typical environment with forced convection over the surface of the PCB and greater than 0.4" headroom, a simple thermal management strategy is to procure V*I Chips with the Pin Fin option. The total Junction-to-Ambient thermal resistance, RJA, of a surface mounted V*I Chip with optional 0.25" Pin Fins is 4.8 C/W in 300 LFM air flow (Figure 24). At full rated output power of 300 W, the heat generated by the BCM is approximately 13 W (Figure 6). Therefore, the junction temperature rise to ambient is approximately 62C. Given a maximum junction temperature of 125C, a temperature rise of 62C allows the V*I Chip to operate at rated output power at up to 63C ambient temperature. At 100 W of output power, operating ambient temperature extends to 103C. CASE 2--Conduction to the PCB The low thermal resistance Junction-to-BGA, RJB, allows use of the PCB to exchange heat from the V*I Chip, including convection from the PCB to the ambient or conduction to a cold plate. For example, with a V*I Chip surface mounted on a 2" x 2" area of a multi-layer PCB, with an aggregate 8 oz of effective copper weight, the total Junction-to-Ambient thermal resistance, RJA, is 6.5C/W in 300 LFM air flow (see Thermal Resistance section, Page 1). Given a maximum junction temperature of 125C and 13 W dissipation at 300 W of output power, a temperature rise of 85C allows the V*I Chip to operate at rated output power at up to 41C ambient temperature. V*I Chip Voltage Transformation Module
300
Output Power
0 -40 -20 0 20 40 60 80 100 120 140
Operating Junction Temperature
Figure 23-- Thermal derating curve
BCM with 0.25'' optional Pin Fins
10 9 8
Tja
7 6 5 4 3 0 100 200 300 400 500 600
JC = 1.1C/W
Airflow (LFM)
JB = 2.1C/W
Figure 22--Thermal resistance
Figure 24--Junction-to-ambient thermal resistance of BCM with 0.25" Pin Fins (Pin Fins available as a separate item.)
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Page 11 of 16
PRELIMINARY
Application Note (continued)
The thermal resistance of the PCB to the surrounding environment in proximity to V*I Chips may be reduced by low profile heat sinks surface mounted to the PCB.The PCB may also be coupled to a cold plate by low thermal resistance standoff elements as a means of achieving effective cooling for an array of V*I Chips, without a direct interface to their case. CASE 3--Combined direct convection to the air and conduction to the PCB. Parallel use of the V*I Chip internal thermal resistances (including Junctionto-Case and Junction-to-BGA) in series with external thermal resistances provides an efficient thermal management strategy as it reduces total thermal resistance. This may be readily estimated as the parallel network of two pairs of series configured resistors. V*I Chip Voltage Transformation Module The TM (Temperature Monitor) port monitors the V*I Chip junction temperature and provides feedback and validation of the thermal management of V*I Chips, as applied in diverse power systems and environments.
V*I Chip Bus Converter Level 1 DC Behavioral Model for 48 V to 12 V, 300 W
IOUT
ROUT
11.7 m
+
1/4 * Iout
+
V*I
1/4 * Vin
VIN
IQ
99 mA
+ -
K
+
VOUT
-
-
(c)
-
Figure 25--This model characterizes the DC operation of the V*I Chip bus converter, including the converter transfer function and its losses. The model enables estimates or simulations of output voltage as a function of input voltage and output load, as well as total converter power dissipation or heat generation.
V*I Chip Bus Converter Level 2 Transient Behavioral Model for 48 V to 12 V, 300 W
8.5 nH
LIN = 20 nH
IOUT
ROUT
11.7 m
Lout = 1.1 nH
+
RCIN
2.5 m 1/4 * Iout
V*I
40 m
RCOUT
1 m
+
CIN VIN
4F
IQ
99 mA
+ -
K
+ -
1/4 * Vin
COUT
55 F
VOUT
-
-
(c)
Figure 26--This model characterizes the AC operation of the V*I Chip bus converter including response to output load or input voltage transients or steady state modulations. The model enables estimates or simulations of input and output voltages under transient conditions, including response to a stepped load with or without external filtering elements.
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Page 12 of 16
PRELIMINARY
Application Note (continued)
Input Impedance Recommendations To take full advantage of the BCM capabilities, the impedance presented to its input terminals must be low from DC to approximately 5 MHz. The source should exhibit low inductance (less than 100 nH) and should have a critically damped response. If the interconnect inductance exceeds 100 nH, the BCM input pins should be bypassed with an RC damper (e.g., 47 F in series with 0.3 ohm) to retain low source impedance and stable operations. Given the wide bandwidth of the BCM, the source response is generally the limiting factor in the overall system response. Anomalies in the response of the source will appear at the output of the BCM multiplied by its K factor. The DC resistance of the source should be kept as low as possible to minimize voltage deviations. This is especially important if the BCM is operated near low or high line as the over/under voltage detection circuitry could be activated. V*I Chip Voltage Transformation Module Input Fuse Recommendations V*I Chips are not internally fused in order to provide flexibility in configuring power systems. However, input line fusing of V*I Chips must always be incorporated within the power system. A fast acting fuse should be placed in series with the +IN port.
Application Circuits
Vo = 9.5 - 13.7 V
+In +Out
48 Vin (38 - 55 Vdc)
TM RSV PC
BCM K Ro
-Out
+Out
-In
-Out
NiPOL 1
NiPOL 2
NiPOL 3
NiPOL 4
LOAD 1
LOAD 2
LOAD 3
LOAD 4
Figure 27--The BCM provides an isolated output from a narrow range input ideal for driving non-isolated point of load converters (niPOLs)
In the following figure; K = BCM Transformation Ratio RO = BCM Output Resistance VO = BCM Output
Vf = PRM Output (Factorized Bus Voltage) VL = Desired Load Voltage VS = PRM Output Set Point Voltage
FPA Local Loop
Vo = VL - IO * RO
VC PC TM IL NC PR VH SC SG OS NC CD +In +Out
ROS
+In
PRM-AL
Factorized Power Bus
Vf = VL K
+Out
TM RSV PC
BCM K Ro
-Out
48 Vin (36 - 75 Vdc)
-In -Out
+Out
-In
L O A D
-Out
VS range = 38 - 55 Vdc B048K120T30 (K = 1/4 : RO = 11.7 m) Figure 28--The PRM regulates its output to provide a constant factorized bus voltage. The output voltage is the nominal load voltage, Vo, at no load and decreases with load at a constant rate equal to the BCM output resistance Ro.
vicorpower.com
800-735-6200
V*I Chip Bus Converter Module
B048K120T30
Rev. 1.0
Page 13 of 16
PRELIMINARY
Application Note (continued)
V*I Chip soldering recommendations V*I Chip modules are intended for reflow soldering processes. The following information defines the processing conditions required for successful attachment of a V*I Chip to a PCB. Failure to follow the recommendations provided can result in aesthetic or functional failure of the module. Storage V*I Chip modules are currently rated at MSL 5. Exposure to ambient conditions for more than 72 hours requires a 24 hour bake at 125C to remove moisture from the package. Solder paste stencil design Solder paste is recommended for a number of reasons, including overcoming minor solder sphere co-planarity issues as well as simpler integration into overall SMD process. 63/37 SnPb, either no-clean or water-washable, solder paste should be used. Pb-free development is underway. The recommended stencil thickness is 6 mils. The apertures should be 20 mils in diameter for the Inboard (BGA) application and 0.9-0.9:1 for the Onboard (J-Leaded). Pick and place Inboard (BGA) modules should be placed as accurately as possible to minimize any skewing of the solder joint; a maximum offset of 10 mils is allowable. Onboard (J-Leaded) modules should be placed within 5 mils. To maintain placement position, the modules should not be subjected to acceleration greater than 500 in/sec2 prior to reflow. Reflow There are two temperatures critical to the reflow process; the solder joint temperature and the module's case temperature. The solder joint's temperature should reach at least 220C, with a time above liquidus (183C) of ~30 seconds. The module's case temperature must not exceed 208 C at anytime during reflow. Because of the T needed between the pin and the case, a forced-air convection oven is preferred for reflow soldering. This reflow method generally transfers heat from the PCB to the solder joint. The module's large mass also reduces its temperature rise. Care should be taken to prevent smaller devices from excessive temperatures. Reflow of modules onto a PCB using Air-Vac-type equipment is not recommended due to the high temperature the module will experience.
Figure 30-- Properly reflowed V*I Chip J-Lead
16 Soldering Time
V*I Chip Voltage Transformation Module Removal and rework V*I Chip modules can be removed from PCBs using special tools such as those made by Air-Vac. These tools heat a very localized region of the board with a hot gas while applying a tensile force to the component (using vacuum). Prior to component heating and removal, the entire board should be heated to 80-100C to decrease the component heating time as well as local PCB warping. If there are adjacent moisture-sensitive components, a 125C bake should be used prior to component removal to prevent popcorning. V*I Chip modules should not be expected to survive a removal operation.
239
Joint Temperature, 220C Case Temperature, 208C
183 165
degC
91
Figure 29--Thermal profile diagram
Inspection For the BGA-version, a visual examination of the post-reflow solder joints should show relatively columnar solder joints with no bridges. An inspection using x-ray equipment can be done, but the module's materials may make imaging difficult. The J-Lead versions solder joints should conform to IPC 12.2 * Properly wetted fillet must be evident. * Heel fillet height must exceed lead thickness plus solder thickness.
vicorpower.com
800-735-6200
V*I Chip Bus Converter Module
B048K120T30
Rev. 1.0
Page 14 of 16
Warranty
Vicor products are guaranteed for two years from date of shipment against defects in material or workmanship when in normal use and service. This warranty does not extend to products subjected to misuse, accident, or improper application or maintenance. Vicor shall not be liable for collateral or consequential damage. This warranty is extended to the original purchaser only. EXCEPT FOR THE FOREGOING EXPRESS WARRANTY, VICOR MAKES NO WARRANTY, EXPRESS OR IMPLIED, INCLUDING, BUT NOT LIMITED TO, THE WARRANTY OF MERCHANTABILITY OR FITNESS FOR A PARTICULAR PURPOSE. Vicor will repair or replace defective products in accordance with its own best judgement. For service under this warranty, the buyer must contact Vicor to obtain a Return Material Authorization (RMA) number and shipping instructions. Products returned without prior authorization will be returned to the buyer. The buyer will pay all charges incurred in returning the product to the factory. Vicor will pay all reshipment charges if the product was defective within the terms of this warranty. Information published by Vicor has been carefully checked and is believed to be accurate; however, no responsibility is assumed for inaccuracies. Vicor reserves the right to make changes to any products without further notice to improve reliability, function, or design. Vicor does not assume any liability arising out of the application or use of any product or circuit; neither does it convey any license under its patent rights nor the rights of others. Vicor general policy does not recommend the use of its components in life support applications wherein a failure or malfunction may directly threaten life or injury. Per Vicor Terms and Conditions of Sale, the user of Vicor components in life support applications assumes all risks of such use and indemnifies Vicor against all damages.
Vicor's comprehensive line of power solutions includes high density AC-DC and DC-DC modules and accessory components, fully configurable AC-DC and DC-DC power supplies, and complete custom power systems.
Information furnished by Vicor is believed to be accurate and reliable. However, no responsibility is assumed by Vicor for its use. Vicor components are not designed to be used in applications, such as life support systems, wherein a failure or malfunction could result in injury or death. All sales are subject to Vicor's Terms and Conditions of Sale, which are available upon request.
Specifications are subject to change without notice.
Intellectual Property Notice
Vicor and its subsidiaries own Intellectual Property (including issued U.S. and Foreign Patents and pending patent applications) relating to the products described in this data sheet. Interested parties should contact Vicor's Intellectual Property Department.
Vicor Corporation 25 Frontage Road Andover, MA, USA 01810 Tel: 800-735-6200 Fax: 978-475-6715 email Vicor Express: vicorexp@vicr.com Technical Support: apps@vicr.com
vicorpower.com
800-735-6200
V*I Chip Bus Converter Module
B048K120T30
Rev. 1.0
01/05

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